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 ZMD31020
Sensor Signal Conditioner
Datasheet
Features
* Digital compensation of sensor offset, sensitivity, temperature drift and non-linearity * Adjustable to nearly all piezo-resistive bridge sensor types * Digital one-shot calibration: quick and precise * Selectable temperature compensation reference: internal or external diode * Output options: 0...5V analog ratiometric voltage 2 or 12 bit digital I C interface * Product traceability by user-defined EEPROM entries * Operation temperature range, depending on product version, up to -40...+125 C * Supply voltage +4.5...+5.5V * Sampling rate 100Hz * Available in SSOP14 or as die
Brief Description
ZMD31020 is a CMOS integrated circuit for highlyaccurate amplification and sensor-specific correction of bridge sensor signals. The device provides digital compensation of sensor offset, sensitivity, temperature drift and non-linearity by a 16-bit RISC micro controller running a correction algorithm. ZMD31020 accommodates nearly all piezo-resistive bridge sensor types. 2 The bi-directional digital I C interface can be used for a simple PC-controlled one-shot calibration procedure, in order to program a set of calibration coefficients into an on-chip EEPROM. Thus a specific sensor and a ZMD31020 are mated digitally: fast, precise and without the cost overhead associated with trimming by external devices or laser. ZMD31020 has been designed for industrial and consumer applications and is specifically suited for most pressure sensors. Demo kit available (incl. calibration PCB, SSOP14 samples, software, technical documentation) Support for industrial calibration available Quick circuit customization possible for large production volumes
Benefits
* * * No external trimming components required PC-controlled configuration and calibration via digital bus interface - simple, low cost High accuracy (0.1% FSO @ -25 to 85 C; 0.25% FSO @ -40 to 125C)
Application Circuit Example
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 1/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
CONTENT
PIN DESCRIPTION ......................................................................................................................................3 CIRCUIT DESCRIPTION .............................................................................................................................4 2.1 Signal Flow ....................................................................................................................................................4 2.2 Configuration Word........................................................................................................................................5 2.3 Differential Sensor ....................................................................................................................................5 2.4 Temperature Sensing ...............................................................................................................................5 2.5 Analog Input Channel ...............................................................................................................................6 2.5.1 Bridge Polarity Setting .......................................................................................................................6 2.5.2 Programmable Gain Amplifier PGA...................................................................................................6 2.5.3 Analog-to-digital Converter ADC .......................................................................................................6 2.5.4 Temperature Measurement ...............................................................................................................7 2.6 Correction Microcontroller CMC................................................................................................................7 2.7 Parameter EEPROM.................................................................................................................................7 2.8 Sensor Signal Correction Method and Sequence.....................................................................................8 2 2.9 Digital I C Interface ...................................................................................................................................8 2.9.1 Digital Corrected Sensor Signal Output and I/O for Calibration and Device Test .............................8 2.9.2 Data Communication Specifics..........................................................................................................8 2.10 The Analog Output Stage....................................................................................................................10 3. ELECTRICAL SPECIFICATION.................................................................................................................10 3.1 Absolute maximum ratings......................................................................................................................10 3.2 Operating Conditions ..............................................................................................................................10 3.3 Electrical Parameters..............................................................................................................................11 3.3.1 Power Supply...................................................................................................................................11 3.3.2 PGA & 12-bit Input ADC ..................................................................................................................11 (4) 3.3.3 Temperature Measurement: Current Sources, on-chip Diode & 12-bit ADC ..............................11 (1) 3.3.4 12-bit ADC ...................................................................................................................................12 3.3.5 EEPROM programming ...................................................................................................................12 2 3.3.6 Serial I C Interface...........................................................................................................................12 (2) 3.3.7 11-bit Output DAC & Output BUFFER .........................................................................................14 3.3.8 Total System ....................................................................................................................................14 4. PACKAGE DIMENSIONS ..........................................................................................................................15 5. DIE DIMENSIONS AND PAD COORDINATES .........................................................................................16 5.1 Die Dimensions .......................................................................................................................................16 5.2 Pad Coordinates .....................................................................................................................................17 6. EVALUATION KIT "ZMD31020KIT" ...........................................................................................................18 7. ORDERING INFORMATION ......................................................................................................................19 8. RELATED DOCUMENTS...........................................................................................................................19 1. 2.
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 2/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
1.
PIN DESCRIPTION
PIN Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Name VOUT VDDA (*) VDD VSS SCL SDA VPP VBN VDDB2 (*) VTN VDDB1 (*) VBP VSSB (**) VSSA (**) Description analog conditioned sensor signal output analog device functions positive supply digital device functions positive supply digital device functions negative supply IC clock input, on-chip pull-up resistor IC data input / output, on-chip pull-up resistor positive EEPROM programming voltage differential sensor signal negative input positive supply for sensor and temperature sensing diode input for temperature sensing diode positive supply for sensor and temperature sensing diode differential sensor signal positive input sensor negative supply analog device functions negative supply
(*) (**)
VDDA, VDDB1 and VDDB2 tied to common on-chip positive supply rail VSSA and VSSB tied to common on-chip negative supply rail
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 3/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
2.
CIRCUIT DESCRIPTION
2.1 Signal Flow
Block diagram of ZMD31050
PGA MUX ADC CMC DAC BAMP TS EEPROM ROM 2 IC programmable gain amplifier multiplexer analog-to-digital converter calibration microcontroller digital-to-analog converter buffer amplifier on-chip temperature sensor (pn-junction) for calibration parameters and configuration for correction formula and -algorithm 2 serial interface: I C data I/O, clock
The ZMD31020's signal path is partly analog (blue) and partly digital (red). The differential signal from the resistive bridge sensor is pre-amplified by the programmable gain amplifier (PGA). There are 3 different adjustable gains. The Multiplexer (MUX) transmits the differential signal or the temperature signal to the ADC in a certain sequence. (The external temperature sensing diode or the internal temperature sensor can be used optionally.) The ADC converts the differential signal with 12 bits resolution and the temperature signal with 10 bits resolution into digital values.
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 4/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet The digital signal correction takes place in the calibration micro-controller (CMC). It is based on a special correction formula located in the ROM and on a set of sensor-specific calibration parameters stored in the 2 EEPROM. The resulting corrected sensor signal is output via the I C-interface (with 12 bits resolution) , or, after conversion by the DAC, as analog voltage (with 11 bits resolution) at the buffer amplifier (BAMP). The programming of the configuration data and of the calibration parameters into the EEPROM (during the 2 calibration procedure) is also realized via the I C interface.
2.2 Configuration Word
Many of the following sections, describing each block of ZMD31020 in detail, will refer to configuration bits, part of the configuration word stored under address &H09 of the parameter EEPROM. These bits are settings for a number of on-chip device functions and select specific functional or parametrical behaviour. The contents of the parameter EEPROM are determined and calculated, written and stored under PC-control during the calibration procedure. Hence the configuration bits are coded and non-volatile stored once calibration of a ZMD31020 device / sensor pair has taken place, and will remain unchanged during regular sensing operation, unless re-calibration is performed 15 14 13 12 11 10 9 8 7 6 CH 5 TS 4 BP 3 G1 2 G0 1 O1 0 O0
Configuration word, stored under address &H09 of the parameter EEPROM Only 7 bits of the configuration word are relevant settings as follows: Bit 0, Bit 1 O0, O1: select ADC's offset compensation Bit 2, Bit 3 G0, G1: select PGA's gain Bit 4 BP: cross-switches differential sensor inputs VBP and VBN Bit 5 TS: selects on-chip vs. off-chip temperature sensor Bit 6 CH: enables PGA's chopper-stabilization The possible options of these settings are shown in table form in the following paragraphs.
2.3
Differential Sensor
ZMD31020 has been specifically designed for ratiometric differential sensors, e.g. Wheatstone bridge type sensors. A ratiometric sensor typically generates a differential output signal proportional to the supply voltage applied to it. The sensor is supplied from VDDB1 or VDDB2 (whichever pin/pad is more favourable layoutwise) at the + side and tied to VSSB at the - side. The sensor's differential output signal is routed to VBP and VBN. Sensor and signal conditioner ZMD31020 have the same supply (see block schematic in section 2.1), hence the differential input voltage seen by ZMD31020 is ratiometric to it's supply voltage.
2.4
Temperature Sensing
The characteristic of a sensor element tends to change with temperature. To compensate for this, ZMD31020 is equipped to measure temperature by an external diode or by an on-chip pn-junction. TS - configuration bit 5 - will select the desired sensor option as follows: TS 0 1 Temperature sensing diode off chip on chip
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 5/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
2.5
Analog Input Channel
ZMD31020's block schematic in section 2.1 shows the structure of the analog input channel. The signal path for the sensor signal as well as for temperature is fully differential up to the ADC. The analog multiplexer provides a cost-effective, sequential conversion by a common ADC. Each signal path can be separated from the source at it`s input and can be short-circuit there for offset-cancellation purposes; for more details see the ZMD31020 Functional Description.
2.5.1
Bridge Polarity Setting
The sensor signal path features a cross-switch to reverse the polarity of the bridge sensor signal. BP - configuration bit 4 - sets the bridge polarity as follows: BP 0 1 Differential signal VBR_P - VBR_N VBR_N - VBR_P
2.5.2
Programmable Gain Amplifier PGA
The PGA realizes a coarse sensitivity adaptation of the bridge sensor signal in several amplification steps (sensitivity fine-tuning takes place later in the CMC). Three different gains can be set by G0 and G1 configuration bits 2 and 3 - as follows: G1 0 1 1 G0 x 0 1 Gain aIN 15.66 24 42
The chopper-stabilisation of the PGA reduces the signal noise and is enabled by CH - configuration bit 6: CH 0 1 Chopper-stabilisation Disabled Enabled
2.5.3
Analog-to-digital Converter ADC
The ADC is a first order charge balancing analog-to-digital converter in full differential switched capacitor technology. The amplified bridge sensor signal is converted by the ADC with full 12 bits resolution against a reference voltage of 0.96 (VDDA - VSSA). As both the signal to be measured as well as the reference voltage, it is measured against, are ratiometric to supply voltage (VDDA - VSSA), the ADC's conversion result is insensitive to supply-tolerances and -instabilities. In addition, the ADC realizes a coarse offset compensation (ADC-RangeShift RSADC) of the bridge sensor signal (offset fine-tuning takes place afterwards in the CMC). RSADC can be set as follows: O1 0 0 1 1 O0 0 1 0 1 RSADC (*) 15/16 7/8 3/4 1/2 (*) ADC-Range-Shift, related to the maximum processable sensor signal span (former name was "CRROB")
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 6/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
2.5.4
Temperature Measurement
The temperature sensing diode, selected by TS - configuration bit 5, is biased with a constant current of 40A. It`s forward drop changes with -2.1mV/ typically, and is passed as differential temperature signal. The 40A K current source is only on during temperature measurement, to prevent any interference with the bridge sensor signal's measurement. The differential temperature signal is resolved by the ADC with only 10 bits, against a differential reference voltage of 0.980V, derived from an on-chip bandgap. Whenever measuring temperature, the ADC is set to RSADC = 15/16.
2.6
Correction Microcontroller CMC
The CMC performs the sensor signal fine-tuning in the digital domain. It is a 16 bit RISC micro-controller, driven by an on-chip clock generator with a nominal clock frequency of 1.5 MHz. The overall clock frequency tolerance is smaller than 25%. The CMC includes a 16-bit width ALU and a (16 x 16)-bit RAM. Furthermore it has a 12bit input counter into which the ADC will serially transmit conversion results; 4096 clock cycles are needed per result. The CMC is connected to a (1k x 16)-bit instruction ROM and a (12 x 16)-bit parameter EEPROM. At the 2 output side the CMC is equipped with an I C-interface as a digital series output for the corrected sensor signal. Initially, during calibration, the same interface is used bi-directionally: to write the configuration word into the EEPROM, to read non-corrected sensor value as well as temperature, and again and finally to write the valid calibration parameters into the EEPROM.
2.7
Parameter EEPROM
The parameter EEPROM is a non-volatile store for 12 parameter values, each with 16 bits of width. Address 0HEX 1HEX 2HEX 3HEX 4HEX 5HEX 6HEX 7HEX 8HEX 9HEX AHEX BHEX Parameter calibration parameter a0 for sensor's non-linearity correction calibration parameter a1 for sensor's offset correction calibration parameter a2 for first order sensor offset drift correction calibration parameter a3 for second order sensor offset drift correction calibration parameter a4 for gain correction calibration parameter a5 for first order gain drift correction calibration parameter a6 for second order gain drift correction low-side scale limit value for corrected sensor signal high-side scale limit value for corrected sensor signal configuration word customer-specific identification word customer-specific identification word Default content 5234 Hex 0023 Hex 2044 Hex 3022 Hex 6356 Hex 1045 Hex 2073 Hex 03E8 Hex 0FA0 Hex 0040 Hex 1234 Hex 5678 Hex
Contents of the parameter EEPROM The configuration word and it's contents under address &H09 have been described already in chapter 2.5. The calibration parameters are stored under addresses &H00 through &H06. The calculation of these parameters is described in the ZMD31020 Functional Description.
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 7/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet Address locations &H07 and &H08 contain a low-side resp. high-side scale limit value for the corrected sensor signal. Lower resp. -higher corrected signal values are clamped arithmetically to these limits by the CMC. Both the low and high-side scale limits can be adjusted with a resolution of 12 bits. The 12 bit limit value must be programmed into the least significant portion of either address. The 4 most significant bit locations of either address are don't care bits and may be programmed freely. Address locations &H0A and &H0B are available for customer-specific identification words, e.g. for traceability purposes. The contents of EEPROM addresses &H00 through &H09 are loaded into the RAM register block of the CMC upon power-on. The configuration bits are routed from the configuration register to the various device functions to be set up, see chapter 6.1. Erasing and programming of the various EEPROM address locations during calibration requires programming pulses of about 12V amplitude and about 10ms pulse width (see section 3.3.5). Further programming details are to find in the ZMD31020 Functional Description. Since a calibration is typically performed only once in a sensor's lifetime, no overhead chip-area for a chargepump has been spent. Thus the programming pulse has to be generated off-chip, and applied at the VPP pin/pad. During normal operation mode the VPP pin/pad must be left open. Note: An on-chip switch short-circuits VPP to VDD in normal operation mode; the switch is opened to release the VPP pin/pad for programming.)
2.8
Sensor Signal Correction Method and Sequence
In normal operation mode (regular sensing operation) the CMC runs a cyclic program which will output a corrected 12-bit sensor value about every 10ms. Within this cycle the CMC stages measurement of the raw` sensor signal with 12 bits resolution, preceded by measurement of temperature in 10 bits, and calculates a corrected sensor output value. Calculation is based on a correction formula to which the 'raw' sensor signal and temperature as measured are applied in first and second order terms - along with the 7 calibration parameters. The measurement procedure of the 'raw' sensor signal and of temperature as well as the correction formula are described in all details in the ZMD31020 Functional description
2.9
Digital I2C Interface
2
The 2-wire I C interface encompasses a clock line input SCL and a bi-directional data line SDA.
2.9.1
Digital Corrected Sensor Signal Output and I/O for Calibration and Device Test
2
During normal operation mode (regular sensing operation) the I C interface will output the corrected sensor signal (12 bits) digitally and serially. During calibration the interface is input for the configuration word, output for the 'raw' non-corrected sensor signal as well as for temperature, and finally again input for the calculated calibration parameters as well as the scale limit values and possibly customer-specific identifiers. As a third option, the interface is used to input digital vectors during device test, e.g. to exercise the output DAC, see section 2.10.
2.9.2
2
Data Communication Specifics
An I C bus is controlled by a master device, which generates the clock, controls the bus access, and generates START and STOP conditions. ZMD31020 is designed to work as a slave - thus it will only respond to requests from a master device. Obviously a typical master device during regular sensing operation is a connected electronic controller unit requesting sensor data. (During calibration a connected PC or computer will be the master. During device test the ATE system will be the master.)
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 8/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet ZMD31020 complies with the following protocol (for data communication timing details see parameter section): * * Bus not busy: During idle periods both data line (SDA) and clock line (SCL) remain HIGH. START condition (S): HIGH to LOW transition of SDA line while clock (SCL) is HIGH is interpreted as START condition. All commands must be preceded by START condition. Master can generate START condition at any time. More than one command can be transmitted without generation of intermediate STOP condition. STOP condition (P): LOW to HIGH transition of SDA line while clock (SCL) is HIGH determines STOP condition. All command sequences must be ended with STOP condition. Data valid (D): State of data line represents valid data when, after START condition, data line is stable for duration of HIGH period of clock signal. Data on line must be changed during LOW period of clock signal. There is one clock pulse per bit of data. Acknowledge (A): Data is transferred in pieces of 8 bits (1 byte) on serial bus, MSB first. After each byte receiving device - whether master or slave - is obliged to pull data line LOW as acknowledge for reception of data. Master must generate an extra clock pulse for this purpose. When acknowledge is missed, slave transmitter becomes inactive. It is on master either to send last command again or to generate STOP condition in that case. Slave address: Each device connected to bus has unique slave address. After generating START condition, master transmits address consisting of 7-bit slave address and R/W - bit. Addressed slave responds with acknowledge while other slaves on bus become inactive and ignore following data bytes. R/W - bit determines direction of data transfer. If R/W is "0", data is transmitted from master to slave (write operation). If R/W is "1", (read operation) data is transmitted from slave to master. Slave address of the IC is hard coded to value 1111000xb. Write operation: When writing to IC, slave address + R/W - bit (F0h) is followed by command byte and - depending on command - optionally 2 data bytes. Calibration microcontroller reads command byte and executes specific program for each command. Commands available are described below. Read operation: When R/W - bit is set to "1" (F1h), IC sends 2 data bytes containing contents of output register of serial interface. To read specific data, master must send special commands before reading which instruct calibration microcontroller to place requested data in serial interface output register.
* *
*
*
*
*
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 9/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
2.10 The Analog Output Stage
ZMD31020`s analog output stage consists of an 11-bit resistor-string linear DAC, which converts the MSBportion of the corrected sensor signal, followed by an output buffer amplifier, designed for full supply voltage range output swing and generating the output voltage VOUT. VOUT presents the actual corrected sensor signal as an analog voltage on a linear voltage scale with 11 bits resolution. The output voltage is ratiometric to the supply voltage (VDDA - VSSA). Furthermore it exhibits low- and high-side scale limits; either limit is programmable and clamping to these limit values is performed digitally by the CMC (see section 2.7 and the ZMD31020 Functional Description). VOUT will change as corrected sensor signal values become available, hence with a refresh rate of about 10ms. VOUT can source/sink a maximum load current of 2mA.
3.
3.1
ELECTRICAL SPECIFICATION
Absolute maximum ratings (all voltages referred to VSSA)
SYMBOL VDDA VDD VD_I/O VA_I/O CONDITIONS to VSS to VSS at all pins, HBM at all pins TSTG MIN -0.3 -0.3 -0.3 -0.3 -2 -100 -40 TYP MAX 6.5 6.5 VDD+0.3 VDDA+0.3 2 100 150 100 UNIT V V V V kV mA C C
PARAMETER Analog supply voltage Digital supply voltage Voltage at all digital I/O Voltage at all analog I/O Guaranteed ESD-immunity Guaranteed latch-up immunity Storage temperature Average storage- and operation temperature for 15 years time of operation
3.2
Operating Conditions
SYMBOL VDDA = VDD TAMB RBR CVDD(A) CONDITIONS to VSSA = VSS MIN 4.5 -40 1 100 TYP 5 MAX 5.5 125 10 470 UNIT V C k nF
PARAMETER Supply voltage Ambient temperature Bridge resistance Capacitance
between VDD = VDDA and VSS = VSSA
220
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 10/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
3.3
Electrical Parameters
C C; (for TAMB = -40 ... +125 supply voltage: 4.5V ... 5.5V; all voltages referred to VSSA = VSS)
3.3.1
Power Supply
SYMBOL IDD + IDDA CONDITIONS no sensor, no diode connected; VOUT open MIN TYP MAX 7.7 UNIT mA
PARAMETER Supply current
3.3.2
PGA & 12-bit Input ADC
UNIT mV/V mV/V mV/V mV/V V/LSB mV/V mV/V mV/V mV/V V/LSB mV/V mV/V mV/V mV/V V/LSB nA
PARAMETER SYMBOL CONDITIONS MIN TYP MAX Differential input voltage range options @ Input span VIN_SP = 52 mV/V; aIN = 15.66 Diff. inp. volt. range 1 VIN_DIFF_1 RSADC = 15/16 -3 49 Diff. inp. volt. range 2 VIN_DIFF_2 RSADC = 7/8 -6 46 Diff. inp. volt. range 3 VIN_DIFF_3 RSADC = 3/4 -13 39 Diff. inp. volt. range 4 VIN_DIFF_4 RSADC = 1/2 -26 26 Sensitivity SIN VDDA = 5V 73 Differential input voltage range options @ Input span VIN_SP = 36 mV/V; aIN = 24 Diff. inp. volt. range 1 VIN_DIFF_1 RSADC = 15/16 -2 34 Diff. inp. volt. range 2 VIN_DIFF_2 RSADC = 7/8 -4 32 Diff. inp. volt. range 3 VIN_DIFF_3 RSADC = 3/4 -9 27 Diff. inp. volt. range 4 VIN_DIFF_4 RSADC = 1/2 -18 18 Sensitivity SIN VDDA=5V 50 Differential input voltage range options @ Input span VIN_SP = 20 mV/V; aIN = 42 Diff. inp. volt. range 1 VIN_DIFF_1 RSADC = 15/16 -1 19 Diff. inp. volt. range 2 VIN_DIFF_2 RSADC = 7/8 -2 18 Diff. inp. volt. range 3 VIN_DIFF_3 RSADC = 3/4 -5 15 Diff. inp. volt. range 4 VIN_DIFF_4 RSADC = 1/2 -10 10 Sensitivity SIN VDDA=5V 29 Diff. input offset current IIN_OFF -10 10
Note, that the parameter "RSADC" is equal to the former "CRROB".
3.3.3
Temperature Measurement: Current Sources, on-chip Diode & 12-bit ADC (4)
SYMBOL ITS TCI_TS VTN TCDROP ST CONDITIONS pin / pad VTN pin / pad VTN rel. to VDDB1 = VDDB2 on-chip temp. sensor pin / pad VTN MIN 20 -2000 -810 -1.9 0.84 TYP 40 MAX 55 2000 -200 -2.3 1.1 UNIT A ppm/K mV mV/K mV/ LSB
PARAMETER Current source (1) TC current source Input voltage range TC forward drop Sensitivity
-2.1 0.97
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 11/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
3.3.4
12-bit ADC (1)
PARAMETER SYMBOL CONDITIONS MIN 12-Bit sensor signal conversion DNLp -0.5 INLp to best-fit straight line -0.5 10-Bit temperature signal conversion DNLT -0.5 INLT to best-fit straight line -0.8 TYP MAX 0.5 0.5 0.5 0.8 UNIT LSB LSB LSB LSB
ADC diff. non-lin. ADC integr. non-lin. ADC diff. non-lin. ADC integr. non-lin.
3.3.5
EEPROM programming
SYM. VPPH VPPL tVPP tVPP_R tVPP_F tVPP_H 9 0.5 0.5 8 100 TPP -40 +85 C 1 1 2 2 MIN. 11.75 TYP. 12.25 VDD MAX. 12.75 V V ms ms ms ms
VPPL tVPP
tVPP_R tVPP_H tVPP_F
PARAMETER Prog. voltage HIGH level Prog. voltage LOW level (conn. to VDD on chip) Prog. cycle duration Rise time VPP Fall time VPP Prog. pulse duration Number of write/read cycles Programming temperature
VPPH
3.3.6
Serial I2C Interface
SYMBOL VI2C_IN_H VI2C_IN_L VI2C_OUT_L RI2C_SCL/SDA II2C_OUT_H CSDA CONDITIONS MIN 0.9 0 470 pins SCL and SDA 5 20 400 A pF TYP MAX 1 0.1 0.1 UNIT VDD VDD VDD
PARAMETER Input high level Input low level Output low level Pull-up-resistance (at SCL and SDA) Pull up current Load capacitance SDA
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 12/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet Timing Characteristics of the serial Interface tI2C_SU_DAT tI2C_HD_DAT tI2C_SU_STA tI2C_HD_STA tI2C_R tI2C_F
tI2C_H
tI2C_L
tI2C_SU_STO tI2C_BF
tI2C_HD_STA
PARAMETER SCL clock frequency Bus free time betw. STOP and START condition Hold Time (repeated) START cond. LOW period of SCL HIGH period of SCL Setup time (repeated) START cond. Data hold time Data setup time Rise time of both SDA and SCL Fall time of both SDA and SCL Setup time for STOP condition Input filter spike suppression / noise interception
SYMBOL fSCL tI2C_BF tI2C_HD_STA tI2C_L tI2C_H tI2C_SU_STA tI2C_HD_DAT tI2C_SU_DAT tI2C_R tI2C_F tI2C_SU_STO tI2C_NI
CONDITIONS
MIN 4.7
TYP
MAX 100
UNIT kHz s s s s s ns ns
to first clock pulse
4.0 4.7 4.0 4.7 0 250 4 300 300
ns ns s
spikes on SDA or SCL of that length are suppressed
50
ns
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 13/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
3.3.7
11-bit Output DAC & Output BUFFER (2)
SYMBOL IOUT VOUT_OFF TCOUT_OFF DNLOUT INLOUT VOUT_MAX VOUT_MIN VOUT_LSL VOUT_HSL RL_OUT CL_OUT CONDITIONS current source & sink MIN 2 -10 -10 -1 -4 0.975 0 0.75 2.5 10 TYP MAX 10 10 1 4 0.025 0.25 1 25 UNIT mA mV V/K LSB LSB VDDA VDDA VDDA VDDA k nF
PARAMETER Output current Analog output offset voltage Temp.-coeff output offset voltage DAC differential nonlinearity DAC integral nonlinearity Maximal output voltage Minimal output voltage VOUT low scale limit VOUT low scale limit Load resistance Load capacitance
to best-fit straight line IOUTSOURCE = 2mA IOUTSINK = -2mA dig. ref.: pmin dig. ref.: pmax
3.3.8
Total System
SYMBOL tSTA tRESP tCYC NL TCp TCT CONDITIONS power up to 1st result MIN TYP MAX 40 11 10 +2500 20 100 UNIT ms ms ms (3) ppm ppm/K ppm/K
PARAMETER Startup time Response time Conversion cycle time Non-linearity TC sensor signal TC temperature
to best-fit straight line
-2500
Notes for the electrical parameters: 1) 2) No measurement in mass production, parameter is guarantied by design. During normal operation mode using the analog output the I C interface allows to read out the output digital value in parallel (= the digital input of the DAC). Analog Signal Conditioning and Analog Digital Conversion for Measurement of the Pressure Sensor Bridge The A/D conversion of the temperature signal is done with 10 bit resolution only.
2
3) 4)
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 14/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
4.
PACKAGE DIMENSIONS
SSOP14 (209mil = 5.3mm) weight: 0.3g package body material: low stress epoxy lead material: FeNi-Alloy or Cu-Alloy lead finish: solder plating lead form: Z-bends
Dimensions of Sub-Group B1 Amax 1.99 Bpmin 0.25 bpmax 0.38 enom 0.65 HEmin 7.65 HEmax 7.90 Lpmin 0.63 Zmax 1.22 All dimensions in mm, reference: DIN EN 190000
Dimensions of Sub-Group C1 Amin 1.73 A1min 0.05 A1max 0.21 A2min 1.68 A2max 1.78 cmin 0.09 cmax 0.20 Dmin* 6.07 Dmax* 6.33 Emin* 5.20 Emax* 5.38 kmin 0.25 min max
* without mold-flesh
0 10
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 15/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
5.
5.1
* * * * *
DIE DIMENSIONS AND PAD COORDINATES
Die Dimensions
Die size (incl. scribeline): 3500m x 3000m = 10.5sqmm Core die size (without scribeline): 3310m x 2810m 9.3sqmm Die thickness: 390m Scribeline (distance between two core dice on wafer): 190m Pads size: 90m x 90m 14 13 12 11 10 9 8
Core Die with Pads
ZMD31020
2810m
y
01 725m
2
x
3
4
5
6
7
3310m
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 16/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
5.2
Pad Coordinates
All pad coordinates refer to the pad centers and related to the left bottom corner of pad 1.
PIN-No.
1 2 3 4 5 6 7 8 9 10 11 12 13 14
PIN Name VOUT VDDA VDD VSS SCL SDA VPP VBN VDDB2 VTN VDDB1 VBP VSSB VSSA
Pad coordinates m X 45 380.2 1403.30 1627.40 1868.8 2143.8 2385.3 2353.4 2091.6 1829.5 1426.7 864.1 478 48.1 Y 45.00 45.00 45.00 45.00 45.00 45.00 45.00 2763.00 2763.00 2763.00 2763.00 2763.00 2763.00 2763.00
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 17/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
6.
EVALUATION KIT "ZMD31020KIT"
An evaluation kit is offered, see the illustration below. The Kit provides easy evaluation and experimental calibration of a sensor element / ZMD31020 combination. It contains a modular calibration board, a CD-ROM (calibration program, USB port driver, technical documentation), an USB cable and some finished samples in SSOP14 package. The evaluation kit is described in detail in its technical documentation.
Fig. 3: Evaluation Kit ZMD31020KIT" (Hardware) Important Note: The Evaluation Kit is not intended to be used for industrial sensor calibration in serial production. If components of the Evaluation Kit are used for this purpose then an EEPROM programming pulse like specified in section 3.3.5 has to be assured. Otherwise the EEPROM data preservation may be affected. For industrial sensor calibration ZMD and its partners offer a comprehensive support for the development of the required hard- and software. Please contact the ZMD sales offices for detailed information.
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 18/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31020
Sensor Signal Conditioner
Datasheet
7.
ORDERING INFORMATION
Description dice on tested unsawn wafer dice on tested sawn wafer dice in waffle tray finished parts in tube finished parts in tape on reel dice on tested unsawn wafer dice on tested sawn wafer dice in waffle tray finished parts in tube finished parts in tape on reel evaluation kit Operation Temp. 0...+70 C 0...+70 C 0...+70 C 0...+70 C 0...+70 C -40...+125 C* -40...+125 C* -40...+125 C* -40...+125 C* -40...+125 C* Package die die die SSOP14 (5.3mm) SSOP14 (5.3mm) die die die SSOP14 (5.3mm) SSOP14 (5.3mm) ZMD 31020BIF ZMD 31020BIF Marking Shipping Form * 6" wafer plastic frame waffle tray (100 dice / tray) ZMD tube 31020BCF (77 parts / tube) ZMD tape on reel 31020BCF (2000 parts / reel) 6" wafer plastic frame waffle tray (100 dice / tray) tube (77 parts / tube) tape on reel (2000 parts / reel) box, containing PCB, CD, USB cable and SSOP14 samples
Ordering Code ZMD31020BCB ZMD31020BCC ZMD31020BCD ZMD31020BCF-T ZMD31020BCF-R ZMD31020BIB ZMD31020BIC ZMD31020BID ZMD31020BIF-T ZMD31020BIF-R ZMD31020KIT
Deviant from the regular industrial operation temperature range of -25 to +85 the ZMD31020 industrial version is specified for -40 to C +125 C. * The quantity ordered should be a multiple of the quantity / packing unit as specified
8.
* * *
RELATED DOCUMENTS
ZMD31020 Software description ZMD31020 Functional description ZMD31020 Response time (application note)
The information furnished here by ZMD is believed to be correct and accurate. However, ZMD shall not be liable to any licensee or third party for any damages, including, but not limited to, personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental, or consequential damages of any kind in connection with or arising out of the furnishing, performance, or use of this technical data. No obligation or liability to any licensee or third party shall result from ZMD's rendering of technical or other services.
For further information:
ZMD AG Grenzstrasse 28 01109 Dresden, Germany Phone +49 (351) 8822-306 Fax +49 (351) 8822-337 sales@zmd.de www.zmd.biz
ZMD America, Inc. 201 Old Country Road, Suite 204 Melville, NY 11747, USA Phone +01 (631) 549-2666 Fax +01 (631) 549-2882 sales@zmda.com www.zmd.biz
ZMD America, Inc. 15373 Innovation Drive, Suite 110 San Diego, CA 92128, USA Phone +01 (858) 674-8070 Fax +01 (858) 674-8071 sales@zmda.com www.zmd.biz
Copyright (c) 2004, ZMD AG, Rev. 1.6, 2005-05-19 19/19 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.


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